Résumé

ISO/TS 10303-1650:2014-02 specifies the application module for Bare die.

The following is within the scope of ISO/TS 10303-1650:2014-02:

The representation of the information needed to describe a semiconductor material product that is an integrated circuit component, or that may be a discrete active component, or that may be included as a component in an electronic assembly. Terminal information is supported, including explicit shape data. A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called a package.

  • definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural simulation model, and shape.


Informations générales 

  • État actuel
     : Annulée
    Date de publication
     : 2014-06
  • Edition
     : 3
  • Comité technique
     : ISO/TC 184/SC 4 Données industrielles
  • ICS
     :
    25.040.40 Mesure et contrôle des processus industriels

Cycle de vie

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