ISO/TS 10303-1650:2018-11 specifies the application module for Bare die.
The following is within the scope of ISO/TS 10303-1650:2018-11:
The representation of the information needed to describe a semiconductor material product that is an integrated circuit component, or that may be a discrete active component, or that may be included as a component in an electronic assembly. Terminal information is supported, including explicit shape data. A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called a package.
- definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural simulation model, and shape.
État actuel: PubliéeDate de publication: 2018-11Stade: Norme internationale confirmée [90.93]
Comité technique :ISO/TC 184/SC 4ICS :25.040.40
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