Résumé
Transient thermal measurement is used to yield the structure function, represented by Cauer model thermal network from junction to ambient. Structure function represents the three-dimensional heat conduction from the junction to the ambient, by the integral of the thermal resistance and the thermal capacitance from junction to the ambient, in a direction perpendicular to the iso-surfaces [2, 3]. For single-sided cooling modules, the direction of "thermal network from the heat source to the heat sink" was almost identical to the "one-dimensional Cauer thermal network represented by structure function showing the direction normal to the iso-surfaces. This article characterizes the thermal parameter for a double-sided cooling module, which is performed using the fact that structure function originally represents three-dimensional heat dissipation. Non-destructive fatigue analysis is shown as an example of the use-case of the calibrated model.
Informations générales
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État actuel: ProjetStade: Nouveau projet enregistré au programme de travail du TC/SC [20.00]
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Edition: 1
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Comité technique :ISO/TC 206
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