Projet de travail
ISO/WD 4825-3
Fine ceramics (advanced ceramics, advanced technical ceramics) — Test method for thermal property measurements of metalized ceramic substrates — Part 3: Evaluation of heat transfer characteristic of metalized ceramic substrates in the horizontal direction for use in power modules
Numéro de référence
ISO/WD 4825-3
ISO/WD 4825-3
Edition 1
© ISO 2026
Projet de travail
Résumé
This document defines a method for evaluating effective in-plane thermal conductivity and conductance of a metalized ceramic substrate bearing a heater chip as an imitation of a SiC power semiconductor. The method provides an indicator for in-plane heat transfer properties of metalized ceramic substrates employed in high-power modules.
Informations générales
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État actuel: ProjetStade: Clôture de la période des observations [20.60]
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Edition: 1
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Comité technique :ISO/TC 206
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