This standard was last reviewed and confirmed in 2017. Therefore this version remains current.
ISO/TS 10303-1688:2010-03 specifies the application module for Interconnect non planar shape.
The following are within the scope of ISO/TS 10303-1688:2010-03:
- three dimensional manifold surface representation of an interconnect substrate;
- placement of footprint and other planar feature definitions in a three dimensional manifold surface representation including changing the planar shape to a manifold shape.
Status : PublishedPublication date : 2010-03
Edition : 2Number of pages : 8
Technical Committee:Industrial data
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This collection is the standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …