ISO/TS 10303-1688:2010 Preview
Industrial automation systems and integration -- Product data representation and exchange -- Part 1688: Application module: Interconnect non planar shape
This standard was last reviewed and confirmed in 2017. Therefore this version remains current.
ISO/TS 10303-1688:2010-03 specifies the application module for Interconnect non planar shape.
The following are within the scope of ISO/TS 10303-1688:2010-03:
- three dimensional manifold surface representation of an interconnect substrate;
- placement of footprint and other planar feature definitions in a three dimensional manifold surface representation including changing the planar shape to a manifold shape.
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