Abstract

ISO/TS 10303-1688:2006 specifies the application module for Interconnect non planar shape.

The following are within the scope of ISO/TS 10303-1688:2006:

  • three dimensional manifold surface representation of an interconnect substrate;
  • placement of footprint and other planar feature definitions in a three dimensional manifold surface representation including changing the planar shape to a manifold shape.


General information 

  • Status
     : Withdrawn
    Publication date
     : 2006-12
  • Edition
     : 1
    Number of pages
     : 40
  • Technical Committee
     : ISO/TC 184/SC 4 Industrial data
  • ICS
     :
    25.040.40 Industrial process measurement and control

Life cycle

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