Abstract

 Preview

This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.


General information 

  • Status
     :  Published
    Publication date
     : 2023-01
  • Edition
     : 1
    Number of pages
     : 12
  • Technical Committee
     : ISO/TC 206 Fine ceramics
  • ICS
     :
    81.060.30 Advanced ceramics

Sustainable Development Goals

This standard contributes to the following Sustainable Development Goals:

7
Affordable and Clean Energy
9
Industry, Innovation and Infrastructure
11
Sustainable Cities and Communities
12
Responsible Consumption and Production

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