ISO/TS 10303-1741:2014-02 specifies the application module for Sequential laminate assembly design.
The following are within the scope of ISO/TS 10303-1741:2014-02:
- sequence of application of an embedded component;
- sequence of material buildup or lamination;
- support for embedded component location;
- items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.
Status : WithdrawnPublication date : 2014-06
Edition : 4Number of pages : 11
Technical Committee:Industrial data