ISO/TS 10303-1741:2018-11 specifies the application module for Sequential laminate assembly design.
The following are within the scope of ISO/TS 10303-1741:2018-11:
- sequence of application of an embedded component;
- sequence of material buildup or lamination;
- support for embedded component location;
- items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.
Status : PublishedPublication date : 2018-11
Edition : 5Number of pages : 11
Technical Committee:Industrial data
Buy this standard
This collection is the standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …