Abstract Preview

ISO/TS 10303-1685:2018-11 specifies the application module for Interconnect module to assembly module relationship.

The following are within the scope of ISO/TS 10303-1685:2018-11:

  • assembly requirement for interconnect substrate;
  • assembly component based symbol placement in substrate requirement;
  • assembly component based annotation text placement in substrate requirement;
  • assembly component feature to layout feature requirement relationship;
  • external references for assembly component;
  • external references for assembly component feature;


General information

  • Status :  Published
    Publication date : 2018-11
  • Edition : 4
    Number of pages : 11
  • :
    ISO/TC 184/SC 4
    Industrial data
  • 25.040.40
    Industrial process measurement and control

Buy this standard

STEP Module and Resource Library (SMRL)
This collection is the standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …

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