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ISO 9453:2006
Soft solder alloys -- Chemical compositions and forms
This standard has been revised by ISO 9453:2014
ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:
- tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
- tin-antimony;
- tin-bismuth;
- tin-copper, with and without silver;
- tin-indium, with and without silver and bismuth;
- tin-silver, with and without copper and bismuth;
- tin-zinc, with and without bismuth.
ISO 9453:2006 also includes an indication of the forms generally available.
General information
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Status : WithdrawnPublication date : 2006-10
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Edition : 2
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- ICS :
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Brazing and soldering
Life cycle
A standard is reviewed every 5 years
Revisions / Corrigenda
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Previously
ISO 9453:1990
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Now withdrawn
ISO 9453:2006 -
Revised by
ISO 9453:2014
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