Abstract

ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:

  • tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
  • tin-antimony;
  • tin-bismuth;
  • tin-copper, with and without silver;
  • tin-indium, with and without silver and bismuth;
  • tin-silver, with and without copper and bismuth;
  • tin-zinc, with and without bismuth.

ISO 9453:2006 also includes an indication of the forms generally available.


General information 

  • Status
     : Withdrawn
    Publication date
     : 2006-10
  • Edition
     : 2
    Number of pages
     : 10
  • Technical Committee
     : ISO/TC 44/SC 12 Soldering materials
  • ICS
     :
    25.160.50 Brazing and soldering

Life cycle

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