Abstract 

ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:

  • tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
  • tin-antimony;
  • tin-bismuth;
  • tin-copper, with and without silver;
  • tin-indium, with and without silver and bismuth;
  • tin-silver, with and without copper and bismuth;
  • tin-zinc, with and without bismuth.

ISO 9453:2006 also includes an indication of the forms generally available.


General information

  • Status :  Withdrawn
    Publication date : 2006-10
  • Edition : 2
    Number of pages : 10
  • Technical Committee
    :
    ISO/TC 44/SC 12
    Soldering materials
  • ICS :
    25.160.50
    Brazing and soldering

Life cycle

A standard is reviewed every 5 years



Revisions / Corrigenda

Got a question?

Check out our FAQs

Customer care
+41 22 749 08 88

Opening hours:
Monday to Friday - 09:00-12:00, 14:00-17:00 (UTC+1)

Keep up to date with ISO

Sign up to our newsletter for the latest news, views and product information.

  2. Store
  3. Standards catalogue
  4. ICS
  5. 25
  6. 25.160
  7. 25.160.50
  8. ISO 9453:2006