Abstract 

ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:

  • tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
  • tin-antimony;
  • tin-bismuth;
  • tin-copper, with and without silver;
  • tin-indium, with and without silver and bismuth;
  • tin-silver, with and without copper and bismuth;
  • tin-zinc, with and without bismuth.

ISO 9453:2006 also includes an indication of the forms generally available.


General information

  • Status :  Withdrawn
    Publication date : 2006-10
  • Edition : 2
    Number of pages : 10
  • Technical Committee
    :
    ISO/TC 44/SC 12
    Soldering materials
  • ICS :
    25.160.50
    Brazing and soldering

Life cycle

A standard is reviewed every 5 years



Revisions / Corrigenda

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