ISO 9455-17:2002 Preview

Soft soldering fluxes -- Test methods -- Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues

ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.

This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.


General information

  • Current status : Published
    Publication date : 2002-12
  • Edition : 1
    Number of pages : 21
  • :
    ISO/TC 44/SC 12
    Soldering materials
  • 25.160.50
    Brazing and soldering

Buy this standard

Format Language
PDF
Paper
  • CHF118

Got a question?

Check out our FAQs


Customer care
+41 22 749 08 88

Opening hours:
Monday to Friday - 09:00-12:00, 14:00-17:00 (UTC+1)