ISO/TS 10303-1689:2018-11 specifies the application module for Interconnect physical requirement allocation.
The following are within the scope of ISO/TS 10303-1689:2018-11:
- thermal isolation requirement definition;
- electrical isolation requirement definition;
- thermal isolation template for substrate design;
- electrical isolation template for substrate design;
- length tolerance on spacing requirement;
- allocation of an isolation requirement to a shield realized as part of an interconnect substrate.
Status : PublishedPublication date : 2018-11
Edition : 5Number of pages : 11
Technical Committee:Industrial data
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This collection is the standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …