Abstract

ISO/TS 10303-1650:2014-08 specifies the application module for Bare die.

The following is within the scope of ISO/TS 10303-1650:2014-08:

The representation of the information needed to describe a semiconductor material product that is an integrated circuit component, or that may be a discrete active component, or that may be included as a component in an electronic assembly. Terminal information is supported, including explicit shape data. A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called a package.

  • definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural simulation model, and shape.


General information 

  • Status
     : Withdrawn
    Publication date
     : 2014-08
  • Edition
     : 4
    Number of pages
     : 11
  • Technical Committee
     : ISO/TC 184/SC 4 Industrial data
  • ICS
     :
    25.040.40 Industrial process measurement and control

Life cycle

Got a question?

Check out our FAQs

Customer care
+41 22 749 08 88

Opening hours:
Monday to Friday - 09:00-12:00, 14:00-17:00 (UTC+1)

  2. Store
  3. Standards catalogue
  4. ICS
  5. 25
  6. 25.040
  7. 25.040.40
  8. ISO/TS 10303-1650:2014