Soft soldering fluxes -- Test methods -- Part 14: Assessment of tackiness of flux residues
This standard has been revised by ISO 9455-14:2017
Specifies a qualitative method applicable to all fluxes, solder pastes and flux cored solder wires. Describes the principle, the reagents and materials, the apparatus, the test pieces, the test procedure, the examination of the test piece, the expression of results, and the contents of the test report.
A standard is reviewed every 5 years
Revisions / Corrigenda