ISO 4746:1977 Preview

Oxygen-free copper -- Scale adhesion test

Provides a means of assessing the usability in electronic devices, for applications involving glass-to-metal seals, or other uses relying on the formation and presence of an adherent film of copper oxide. The procedure includes preparation and heating in air of a test piece, followed by rapid cooling in water and visual examination for loss of the oxide film or blistering.


General information

  • Current status : Published
    Publication date : 1977-08
  • Edition : 1
    Number of pages : 1
  • :
    ISO/TC 26
    Copper and copper alloys
  • 77.040.99
    Other methods of testing of metals

Buy this standard

Format Language
PDF
Paper
  • CHF38

Got a question?

Check out our FAQs


Customer care
+41 22 749 08 88

Opening hours:
Monday to Friday - 09:00-12:00, 14:00-17:00 (UTC+1)