ISO/TS 10303-1622:2006
ISO/TS 10303-1622:2006
недоступно на русском языке
Текущий статус : Опубликовано (Hа стадии пересмотра)
Последний раз этот стандарт был пересмотрен в  2020. Поэтому данная версия остается актуальной


ISO/TS 10303-1622:2006 specifies the application module for AP210 interconnect technology constraints.

ISO/TS 10303-1622:2006 deals with the representation of interconnect technology constraints. This data includes all information provided to the design team by fabrication suppliers from which may be derived default land and passage definitions, based on the desired yield for fabrication and assembly processes. Typical data includes

  • minimum annular ring,
  • maximum passage aspect ratio,
  • minimum deposition thickness,
  • maximum terminal size supported for through hole technology class, and
  • other critical material processing properties.

Configuration management information and design change management information is provided. This data includes at least one geometric representation. ISO/TS 10303-1622:2006 also supports description of simple and complex templates for layout design, and definition of technology specific layer stackup models able to support multiple material combinations.

The following are within the scope of ISO/TS 10303-1622:2006:

  • fabrication technology properties;
  • layout pattern templates;
  • layout pattern template properties;
  • definition of stratum stack model;
  • manufacturing technology specification;
  • generic layered manufacturing technology properties.

Общая информация

  •  : Опубликовано
     : 2006-12
    : Рассылка краткого отчета о пересмотре [90.60]
  •  : 1
  • ISO/TC 184/SC 4
  • RSS обновления


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This collection is a standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …

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