ISO/TS 10303-1741:2010-07 specifies the application module for Sequential laminate assembly design.
The following are within the scope of ISO/TS 10303-1741:2010-07:
- sequence of application of an embedded component;
- sequence of material buildup or lamination;
- support for embedded component location;
- items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.
Edition: 3 (Monolingual) ICS: 25.040.40 Status: Published Stage: 90.92 (2013-07-08) TC/SC: ISO/TC 184/SC 4 Number of Pages: 8
Revised by: ISO/NP TS 10303-1741
Revises: ISO/TS 10303-1741:2010