This standard has been revised by: ISO/TS 10303-1741:2014
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ISO/TS 10303-1741:2010-07 specifies the application module for Sequential laminate assembly design.
The following are within the scope of ISO/TS 10303-1741:2010-07:
- sequence of application of an embedded component;
- sequence of material buildup or lamination;
- support for embedded component location;
- items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.
Document published on: 2010-07-15 Edition: 3 (Monolingual) ICS: 25.040.40 Status: Withdrawn Stage: 95.99 (2014-11-18) TC/SC: ISO/TC 184/SC 4 Number of Pages:
Revised by: ISO/TS 10303-1741:2014
Revises: ISO/TS 10303-1741:2010
No corrigenda or amendments available