Subscribe to updates
ISO/TS 10303-1716:2010
Industrial automation systems and integration -- Product data representation and exchange -- Part 1716: Application module: Layered interconnect complex template
Related Publications
| Title | Price | Language | ||
|---|---|---|---|---|
| STEP Module and Resource Library (SMRL) | HTML on CD | CHF 352,00 | Add to basket |
Abstract
ISO/TS 10303-1716:2010-07 specifies the application module for Layered interconnect complex template.
The following are within the scope of ISO/TS 10303-1716:2010-07:
- footprint definition;
- footprint definition shape;
- padstack definition;
- padstack definition shape;
- items within the scope of application module Layered interconnect simple template, ISO/TS 10303-1718;
- items within the scope of application module Physical unit 2d shape, ISO/TS 10303-1726.
-
Edition: 3 (Monolingual) ICS: 25.040.40 Status: Published Stage: 60.60 (2010-09-03) TC/SC: ISO/TC 184/SC 4 Number of Pages: 8 -
Revises: ISO/TS 10303-1716:2010
-


